NXP Semiconductors Austria GmbH
Testing e-passport chips according to BSI TR-03105 part 3
NXP Semiconductors Austria GmbH is a leading manufacturer of chip solutions for electronic passports. In order to test their compliance with national and international requirements for electronic travel documents, NXP commissioned secunet’s certification office for IT conformity. Testing was conducted according to the Technical Guideline of the German Federal Office for Information Security BSI TR-03105 Part 3. These tests determine whether the data stored on the e-passport chip are interoperably readable world-wide and whether the mechanisms for protection of the data on the chip are correctly implemented.